Pulse and pulse reverse plating—Conceptual,advantages and applications
IR@CECRI: CSIR-Central Electrochemical Research Institute, Karaikudi
View Archive Info| Field | Value | |
| Title |
Pulse and pulse reverse plating—Conceptual,advantages and applications
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| Creator |
Chandrasekar, M.S.
Pushpavanam, M. |
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| Subject |
Industrial Metal Finishing
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| Description |
A review on pulse and pulse reverse techniques for electrodeposition have been attempted. Pulse electrodeposition (PED) of some metals and
alloys are reported. The effects of mass, transport, electrical double layer pulse parameters and current distribution on surface roughness and
morphology are presented. Applications, advantages and disadvantages of PC and PRC techniques are discussed along with theoretical aspects
and mechanism.
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| Publisher |
Elsevier Ltd.
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| Date |
2008
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| Type |
Article
PeerReviewed |
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| Format |
application/pdf
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| Identifier |
http://cecri.csircentral.net/110/1/041-2008.pdf
Chandrasekar, M.S. and Pushpavanam, M. (2008) Pulse and pulse reverse plating—Conceptual,advantages and applications. Electrochimica Acta, 53 (8). pp. 3313-3322. |
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| Relation |
http://cecri.csircentral.net/110/
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