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Optimization of LTCC Structure for Stable Interconnections

IR@CEERI: CSIR-Central Electronics Engineering Research Institute, Pilani

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Title Optimization of LTCC Structure for Stable Interconnections
Creator Kharbanda, D
Khanna, PK
Kumar, S
Sharma, IC
Subject Hybrid Microcircuits
Description Reliability of electrical connections of a Low Temperature Co-fired Ceramics (LTCC) device is always a challenge. LTCC base plates are fabricated, over which a device or a sensor can be placed. Vias punched at the corners allows the provision for the electrical connection to the sensor. Conductive PdAg lines printed over the surface can be used to join the sensor part with the base plate using brazing technique. Cost of fabrication is lowered by punching the cavities using a zig fixture.
Date 2013
Type Conference or Workshop Item
Format application/msword
Identifier http://ceeri.csircentral.net/23/1/Full_Paper_MNF-2013.docx
Kharbanda, D and Khanna, PK and Kumar, S and Sharma, IC (2013) Optimization of LTCC Structure for Stable Interconnections. In: 1st National Conference on Micro and Nano Fabrication (MNF-2013), January 21-23, 2013, CMTI, Bangalore. (Submitted)
Relation http://ceeri.csircentral.net/23/